History

HISTORY

2022
- Patent registration(Patent No.10-2381390, Spindle device with buffer structure)/li>
2021
- Factory expansion and relocation(Gimpo Hakwoon 6 Industrial Complex)
- Developed semiconductor wafer polishing spindle Cup wheel 200Ø
- Developed deburring spindle 80Ø, 2.4KW, 30,000RPM
2017
- Perform national task(2 things)
- Development of spindle for internal grinding
120Ø, 10kw, 30,000rpm / 100Ø, 10kw, 60,000rpm / 120Ø, 6kw, 60,000rpm - Development of spindles for CNC high speed processing machine
80Ø, 60,000rpm, ISO 10(ATC) / 80Ø, 70,000rpm, HSK E25(ATC) 80Ø, 75,000rpm, ER11 / 62Ø, 125,000rpm - 150Ø, 15,000RPM Development of direct spindl
2016
- Development of work-head spindle for tool grinding
- Development of spindle for grinding dresser 62Ø, 30,000RPM
- Development of spindle for testing machine 110Ø, 40,000RPM, HSK E40
- Spindle development 80Ø, 60,000RPM, SK10
- Development of center hole type spindle 170Ø, 25KW, 12,000RPM, BT40
2015
- Developed ultra high-speed spindle for processing semiconductor holes 62Ø, 1.4KW, 105,000RPM,ER11 (ceramic ball bearing)
- Developed ultra high-speed spindle for grinding bores 120Ø, 11KW, 51,000RPM, straight type


2014
- Selected for national projects (Developing core technologies to assess and improve the reliability of the power unit for new growth)
- Invited to present a lecture at a technological seminar (recommended by KOMMA, technological lectures on the design of spindles (twice in Changwon and Gwacheon)
- Developed spindle for grinding LCD glass 110Ø, 5.5KW, HSK C40, 12,000RPM
- Developed spindle for automobile tests 120Ø,11kw,45,000rpm/150Ø,18kw,36,000rpm
- Developed spindle for grinding bores 100Ø, 4kw, 60,000rpm/120Ø,11kw,51,000rpm
- Developed spindle for machine tools 170Ø,25kw,24,000rpm,BT40
- Developed heavy-industry type spindle 80Ø,3.3kw,30,000rpm,straight
2013
- Developed synchronous motor spindle for processing aircraft parts
120Ø,HSK40,24,000RPM(option : encoder+ rotary joint) - Developed air bearing spindle
62Ø,ER11,125,000RPM
2012
- Developed spindle for machine tools 230Ø,HSK63 / 110Ø,BBT30 / 100Ø, HSK40
- Developed spindle for grinding LCD glass
- Developed spindle for grinding bores 90Ø, 2.5KW, 50,000RPM(option:oil-air)
- Factor newly constructed and moved
- Registered as venture company
- Registered design for tool gripper
2011
- Obtained patents (four patents)
- Patent No. 10-1081891(Rotary Joint) - Patent No. 10-1081893(Rotary Joint)
- Patent No. 10-1090953(Spindle device) - Patent No. 10-1131386(Rotary Joint) - Established a dedicated department for research and development
- Obtained ISO 9001 certificate
- Developed spindle for grinding LCD glass 60Ø, special taper, 40,000rpm
- Developed high-speed rotary joint max 35,000rpm
- Developed spindle for teeth processing 62Ø, PC6, 60,000rpm
2010
- Developed spindle for grinding LCD glass
80Ø, special taper, 12,000rem - 80Ø, straight, 30,000rpm
- 110Ø, special taper, 12,000rem
2009
- Developed spindle for grinding automotive glass 100Ø, ISO40, 12,000rpm
- Developed spindle for machine tools HSK 63 / HSK 50 / BT 30
- Developed spindle for grinding cylinders (bores) 90Ø,MT2, 30,000rpm
2008
- Company name changed to Samwoo Hitech (designing and manufacturing spindles)
- Developed spindle for engraving machines BT15 / ER16 / ISO20 / HSK E25 / HSK E30
- Developed spindle for machines tools 120Ø,BT30, 24,000rpm -140Ø,HSK E40, 24,000rpm
1999
- Samwoo Precisions established (processing machine parts)
